Semi-conductors Industry-CMP

Chemical Mechanical Polishing ( Planerazation) Our HF and NH4F can be successfully used in solutions for this growing application that allows achieving flat wafer surfaces after several process steps. In recent years, CMP has been used also after metallization in dual damascene structures, as Copper is very difficult to etch.  Products Ammonium Fluoride, 40 %, 10 ppb Grade (CMP) Ammonium Fluoride, 40 %, 10 ppb Grade (CMP) Hydrofluoric Acid, 49 %, 1 ppb Grade (CMP) Hydrofluoric Acid, 49 %, 1 ppb Grade (CMP) Hydrofluoric Acid, 49%, 10 ppb Grade (CMP) Hydrofluoric Acid, 49%, 10 ppb Grade (CMP)   Back