Semi-conductors Industry-Wet Etching

Our Wet Processing Chemicals Hydrofluoric Acid and Ammonium Fluoride are important components in a broad range of etchants used to structure silicon oxide layers. Etching removes selected material from the chip surface to create the device structures. Furthermore a number of solutions containing Hydrofluoric Acid are used to clean wafer surfaces.     Products Ammonium Fluoride, 40 %, 10 ppb Grade (W) Ammonium Fluoride, 40 %, 10 ppb Grade (W) Hydrofluoric Acid, 49 %, 1 ppb Grade (W) Hydrofluoric Acid, 49 %, 1 ppb Grade (W) Hydrofluoric Acid, 49%, 10 ppb Grade (W) Hydrofluoric Acid, 49%, 10 ppb Grade (W)   Back