 |
Plasma Etching is used for devices defining steps. In plasma dielectric etching it is important to control the plasma chemistry in order to balance etching, depostion and sputtering species in such way to be able to slectively etch only some of materials and to be able to unisotropically produce vertical profiles.
|
Sifren® 46 (E) |
Sifren® 46 (C4F6 or Hexafluorobutadiene) is a fluoro compound with two double bonds in the molecule;produced by Solvay Fluor
|
 |
|
|
|
